Polished 99.6% Al2O3 Alumina Ceramic Substrates for Thin Film Electronic Circuit

• Customization: Available
• Application: Refractory, Industrial Ceramic
• Material: Alumina Ceramic
• Model NO.: YN10002
• Color: White
• Shape: Round, Square, Rectangular
• Feature: Available with High Adhesion Strength Mo-Mn
• Working Temperature: 1600c 1800c
• Purtiy: 99.6% Al2O3 Alumina, Aluminum Oxide
• Type: Ceramic Plates
• Transport Package: Pallet
• Specification: CUSTOMIZED
• Trademark: Yunnuo
• Origin: China
• HS Code: 8547100000
• Production Capacity: 500000 PCS/Year
• Package Size: 10.00cm * 10.00cm * 3.00cm
• Package Gross Weight: 0.020kg

Product Description

We can provide thin-film ceramic substrates,thin-film circuits and thick-film circuits.
Advanced technology capability:powder modification,casting,sintering,CMP,sputtering,evaporation, photolithography, electroplating, etching, screen printing
Isostatic pressure, laser cutting, etc

1.Electronic ceramic substrate


Size:
Maximum Outer Dimensions 152.4mm.
Outer Dimension ± 0.3mm.
Typical Dimensions
50.8 *50. 8mm,76.2mm*76.2mm,101.6mm*101.6mm,OD 101.6mm

Substrate thickness
T:0.1- 3mm
Grinding and Polishing Disc Thickness ±0.01 mm
Typical thickness :0.127,0.254,0.381,0.508,0.635



 

2.Thin film circuit

Adopting precision processes such as sputtering, evaporation, and lithography, suitable for
producing high-density, small-sized, high-performance passive circuits, typical
products include precision resistors, chip capacitors, filters, power dividers, and electronics
Bridges, ferrite microstrip circuits, etc., widely used in RF, microwave, optical communication
Widely used in fields such as automotive electronics and medical electronics.



Basilar plate:alumina ceramic
Metal:sputtering Ti,TiW,TaN,Au,NiCr,Cu,Ni,Cr and Pt
electroplating: Cu, Ni, and Au
evaporation: AuSn, Pt

Parameter:

Item	TaN	NiCr
Resistance temperature coefficient(ppm/C-25 to 125C)	-100±50	0±50
Resistor change rate(%,1000h@125C)	0.2	0.2
Maximum aging temperature C	450	350
Recommended use environment	Air and an inert atmosphere 350 (<0.5 hours)	Inert atmosphere or passivation layer coating 250 (<0.5 hours)

Common membrane lineage structure




Single-layer Chip Capacitive (SLC)


Small size, high application frequency (up to 100GHz); It is mainly used for isolation and filtering in RF, microwave, and millimeter wave circuits.

Working temperature: -55 C~+85 C; The standard film system structure is TaN/TiW/Ni/Au, which meets various micro assembly process requirements such as adhesive, welding, and eutectic.

The withstand voltage value below 100pF is 100V, and the withstand voltage value above 100pF is 50V.